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MLCAD 2026 – ACM/IEEE International Symposium on Machine Learning for CAD

Event artwork for MLCAD 2026 – ACM/IEEE International Symposium on Machine Learning for CAD

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Baum Design SystemsEmpyreanITDA SemiconductorTelechipsAlsemy
About this event

What to expect

MLCAD 2026 brings together researchers, engineers, and industry leaders to explore cutting-edge applications of machine learning and artificial intelligence in electronic design automation. This ACM/IEEE symposium, co-sponsored by IEEE CEDA and ACM SIGDA, will take place September 7–9, 2026 at Parnas Hotel in Seogwipo, Jeju, South Korea.

What to Expect

MLCAD 2026 focuses on ML applications across all aspects of CAD for electronic circuits, chips, and systems. The symposium provides a platform for presenting innovative research on algorithms, software, models, and emerging solutions like Large Language Models for CAD. Whether you're working on chip design optimization, verification, synthesis, or physical design, this event offers insights into how AI is transforming the semiconductor industry.

The symposium features multiple tracks including research paper presentations, an MLCAD Contest with three submission phases, and special sessions exploring frontier topics in ML-enhanced CAD. Silver sponsors including Baum Design Systems, Empyrean, ITDA Semiconductor, Telechips, and Alsemy demonstrate strong industry engagement.

Who Should Attend

This symposium is ideal for:

  • Researchers developing ML algorithms for electronic design automation
  • Chip designers implementing AI-driven optimization techniques
  • CAD tool developers exploring machine learning integration
  • Graduate students and academics working on semiconductor design
  • Industry practitioners seeking to understand state-of-the-art ML/CAD research

Key Topics and Research Areas

Presentations and papers cover machine learning applications to enhance CAD workflows, including algorithmic innovations, benchmarking studies, software tools, and practical implementations. The symposium emphasizes both theoretical advances and real-world applications, bridging academic research with industry needs.

The technical program is curated by Cunxi Yu (University of Maryland) and Vidya A. Chhabria (Arizona State University), with general chairs Yibo Lin (Peking University) and Youngsoo Shin (KAIST) leading the event. The steering committee includes distinguished researchers from University of Nebraska-Lincoln, North Carolina State University, Technical University of Munich, and UC San Diego.

Contest Opportunity

The MLCAD Contest runs from March through June 2026, offering participants hands-on experience solving real CAD challenges using machine le

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